2024年11月8日 · A Glass Core Substrate is an advanced material used in semiconductor packaging, designed to replace traditional organic substrates. Made from specialized glass, these substrates offer superior thermal resistance, mechanical stability, and low signal loss compared to organic materials like FR4 or BT.

Samtec’s proprietary Glass Core Technology process leverages the performance benefits of glass to enable performance optimized, ultra-miniaturized substrates for next generation designs. These dimensions are guidelines designed to help release product to manufacturing as …

2024年10月1日 · Glass core substrates are emerging as a possible solution for achieving the interconnect density needed to power applications like artificial intelligence (AI) and high-performance computing (HPC).

2024年6月17日 · Glass core substrates represent a promising frontier for advanced IC substrates and advanced packaging in general. They offer unparalleled performance and scalability for next-generation chip designs and packages.

Applicability of potential applications for glass material in semiconductor field. Where is glass required? Type of glass material used?

PLANOPTIK’s Structured Glass Substrates are engineered with precision features, such as through-holes, cavities, and intricate microstructures. These substrates are ideal for cutting-edge applications, providing unmatched performance and flexibility.

2023年9月18日 · As a result of their progress with research and development on the glass cores, Intel is now planning on introducing glass core substrates to its products in the second half of this decade,...

2024年5月29日 · Glass substrates ensure consistent focal plane alignment during lithography, enabling the creation of fine-pitch interconnects and intricate circuit patterns with superior accuracy and reproducibility.

2023年9月18日 · The Glass Core Substrate will do things like improve power delivery and get high-efficiency I/O on the package. Intel also is planning a glass-based coupling with integrated waveguides for the pluggable co-packaged optics that were shown at Intel Innovation 2022 .

2024年3月19日 · As IFTLE discussed previously (IFTLE 575), Intel’s plan is to replace the traditional woven glass core found in traditional laminates with a solid glass core. The advantages can be seen in Figure 3, such as higher dimensional stability, higher through-hole density, and higher speed signaling.