A step forward in the development of diamond CMOS integrated circuits. A research team at NIMS has developed the world’s ...

In the quest to design the next generation of materials for modern devices—ones that are lightweight, flexible and excellent ...

According to projections, the expanded polystyrene (EPS) packaging market is estimated to grow from USD 13,179 million in ...

F or some, installing a CPU is one of the easiest parts of building a new PC. For others, it can be nerve-wracking, ...

Gobik provide race clothing to WorldTour teams, so it is being put through its paces, now it has come to me for a thorough ...

which aids in reducing the thermal resistance between interfaces. Polymers are commonly used as a matrix for TIMs because of their excellent mechanical properties, ease of handling, and flexibility.

A study from UMass Amherst shows that defective fillers in polymers improve heat dissipation by 160 %, offering new insights ...

Innovative Functional Materials Research Institute, National Institute of Advanced Industrial Science and Technology, 4-205 Sakurazaka, Nagoya, Aichi 463-8560, Japan Innovative Functional Materials ...

The HTHFS features a three-layer coated structure comprising a 99% Al2O3 ceramic substrate, PtRh10/Pt thermopile sensitive layer, and composite ceramic thermal resistance layer (TRL). The effective ...

Architects, glaziers and fabricators are faced with a variety of sustainability demands and stringent energy performance ...

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

The UMass Amherst-led team is challenging the common belief that perfect fillers are the best choice for creating thermally ...