Thin Film Packaging (TFP) is a cost effective packaging for MEMS, thanks to the wafer level process, the silicon area saving, and the compatibility with CMOS facilities. One of the most important ...

A 4×112 Gbps/fiber VCSEL link was demonstrated using a co-packaged coarse wavelength division multiplexing (CWDM) optical module. Vertical-cavity surface-emitting lasers (VCSELs) at 990 nm, 1015 nm, ...

Nitrogen in reflow is a tool – not a requirement. For fine-pitch work, bottom-terminated components (BTCs), low-residue ...