双方的新协议专注于持续推进下一代半导体节点和架构的技术进步，通过结合 IBM 的半导体工艺集成知识和 TEL 的尖端设备，探索可满足未来生成式 AI 对性能与能效两方面要求的尖端芯片，助力人工智能发展。

Advertisers are already scaling back investments, with industry analysts slashing 2025 growth forecasts from 4.5% to 3.6%.

Zhang Wengang, executive director of the UHD World Association, noted that U.S. tariffs have had the surprising effect of ...

SINGAPORE, April 25 (Xinhua) -- Leading Chinese powertrain manufacturer Weichai has been honored with one of Singapore's prestigious business awards for its achievement in developing a diesel engine ...

快科技4月25日消息，无论从哪方面看，18A工艺节点都将是Intel历史上的一个关键转折点，对内对外都是如此，甚至在很大程度上决定了Intel的未来，好消息是目前看来进展还不错。Intel此前已经官宣，18A工艺已进入风险试产阶段，将在下半年量产，首 ...