Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

Korean firms accelerate glass substrate development to challenge Nvidia, TSMC Domestic tech giants ramp up glass substrate ...

Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due ...

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Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical... Wednesday 22 ...

Samsung Electronics is entering the glass substrate market to enhance semiconductor technology. Other companies, including Intel and LG Innotek, are also pursuing this innovation.

PETALING JAYA: Chip giant Intel Corp is said to have partially paused its new chip-packaging and testing project in Penang, which is a part of the US$7bil investment announced three years ago.

Department of Chemistry, Queen’s University, Kingston, ON K7L 3N6, Canada Carbon to Metal Coating Institute (C2MCI), Queen’s University, Kingston, ON K7L 3N6, Canada ...

Intel hasn't caught up with transistor manufacturing since its ill-fated 10 nm node, and after almost a decade, this is its chance to catch up. Looking ahead to the rest of the year, we will ...

The most common brand of processor in laptops you can buy in the UK is Intel. However, Intel's myriad of marketing names for its various processors can make comparisons extremely tricky. In this guide ...

Gorilla Armor 2 was launched this month, and it’s the latest version of the popular scratch-resistant glass for smartphones and tablets. The tech has been available for over a decade now ...

Steve Woo, distinguished inventor and fellow at Rambus, examines the benefits of a common substrate for communication, the impact of pre-processing data in or near memory, and how to mitigate thermal ...