VeriSilicon launches the GCNano3DVG, a new ultra-low power graphics processing unit (GPU) IP for wearable devices.

Hirose Electric has launched what it claims is one of the industry’s smallest back flip FPC connectors for automotive and other harsh environment applications.

Introduced last year the RA0 MCU series has been adopted by a wide range of customers due its affordability and low power ...

TSMC reported strong demand for its most advanced chips - 3-5nm - in its latest quarterly update despite US tariffs.

The portfolio of 1200V SiCPAK power modules, enabled by advanced epoxy-resin potting technology, are engineered to withstand ...

Cadence to acquire Arm's Artisan foundation IP business, consisting of cell libraries, memory compilers, and GPIOs.

SMEs and start-ups sometimes face a multifaceted challenge involving integrating sophisticated photonics components into ...

The JEDEC Solid State Technology Association, the global developer of standards for the microelectronics industry, has ...

STMicroelectronics has announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series ...