In the quest to design the next generation of materials for modern devices—ones that are lightweight, flexible and excellent ...

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

In the quest to design the next generation of materials for modern devices -- ones that are lightweight, flexible and excellent at dissipating heat -- a team of researchers made a discovery: ...

This audio story explores how the utility overcame numerous challenges while rebuilding its Mt. Storm to Valley line in extreme mountainous terrain. This audio story explores how NYPA is streamlining ...

A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...

New research suggests that plastics made with fillers that contain defects may perform up to 160% better than those with ...

In the quest to design the next generation of materials for modern devices – ones that are lightweight, flexible and ...

The first quarter started positively, with several customer projects from the 150-strong pipeline moving closer to ramp-up and commercial phase. The Advanced segment showed strong momentum during the ...

The global thermal insulation material market is undergoing a major transformation as demand for sustainable insulation materials and high-performance Thermal Insulation Material Market continues to ...

Panda Windows & Doors has announced new thermally broken window designs with aluminum frames - now available through its ...

Ampleon announces the release of its latest high-power RF transistor, the ART800PE(G), built on the company’s Advanced Rugged Technology (ART). Designed to withstand the harshest operating conditions, ...