Thin Film Packaging (TFP) is a cost effective packaging for MEMS, thanks to the wafer level process, the silicon area saving, and the compatibility with CMOS facilities. One of the most important ...

Reliable lead free solders are needed for products exposed to extreme environments such as those used in the automotive, avionics, and oil-exploration industries, as well as in military applications.

Nitrogen in reflow is a tool – not a requirement. For fine-pitch work, bottom-terminated components (BTCs), low-residue ...