Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

Korean firms accelerate glass substrate development to challenge Nvidia, TSMC Domestic tech giants ramp up glass substrate ...

Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due ...

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Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical... Wednesday 22 ...

Samsung Electronics is entering the glass substrate market to enhance semiconductor technology. Other companies, including Intel and LG Innotek, are also pursuing this innovation.

Department of Chemistry, Queen’s University, Kingston, ON K7L 3N6, Canada Carbon to Metal Coating Institute (C2MCI), Queen’s University, Kingston, ON K7L 3N6, Canada ...

The device uses a beam of light emitted by a silicon-photonics chip to manipulate particles millimeters away from the chip surface, while the sample remains sterile under its glass cover. T... » read ...

Intel hasn't caught up with transistor manufacturing since its ill-fated 10 nm node, and after almost a decade, this is its chance to catch up. Looking ahead to the rest of the year, we will ...

The most common brand of processor in laptops you can buy in the UK is Intel. However, Intel's myriad of marketing names for its various processors can make comparisons extremely tricky. In this guide ...

Intel confirmed its next major client CPU architecture during a conference call today: “Nova Lake,” which will debut in 2026. The news was delivered by Michelle Johnston Holthaus, who heads ...

Gorilla Armor 2 was launched this month, and it’s the latest version of the popular scratch-resistant glass for smartphones and tablets. The tech has been available for over a decade now ...