Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

Korean firms accelerate glass substrate development to challenge Nvidia, TSMC Domestic tech giants ramp up glass substrate ...

Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due ...

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Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical... Wednesday 22 ...

Samsung Electronics is entering the glass substrate market to enhance semiconductor technology. Other companies, including Intel and LG Innotek, are also pursuing this innovation.

Department of Chemistry, Queen’s University, Kingston, ON K7L 3N6, Canada Carbon to Metal Coating Institute (C2MCI), Queen’s University, Kingston, ON K7L 3N6, Canada ...

Intel hasn't caught up with transistor manufacturing since its ill-fated 10 nm node, and after almost a decade, this is its chance to catch up. Looking ahead to the rest of the year, we will ...

Steve Woo, distinguished inventor and fellow at Rambus, examines the benefits of a common substrate for communication, the impact of pre-processing data in or near memory, and how to mitigate thermal ...

“People are used to this nice, formal PDK,” said Park. “When you go to packaging, it’s all over the map, and it changes all the time.” More than just leadframes and substrates The simplest packages ...

Intel is showing bullish technical momentum in early 2025, suggesting a major bottom and strong investor gains are coming this year, despite recent struggles. Intel's valuation is extremely cheap ...

The company plans to launch a pilot production line for glass core substrates in the second half ... and also in line with giants such as Intel, Samsung, and TSMC. "BOE is shifting its resources ...