The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

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This technology enable building circuits in 3 dimensional (3D ... Jeff, S. Sadasivan, S. John and W. Clair, Die Stacking (3D) Microarchitecture, Microarchitecture, 2006. MICRO-39. 39th Annual IEEE/ACM ...

The AMD Strix Halo APUs have already set new performance benchmarks in the mobile computing space, but the latest findings indicate that ...

Moreover, a 3D DRAM-centric LLM accelerator is proposed and benchmarked against the off-the-shelf GPU platforms with high-bandwidth-memory (HBM) with die stacking of 2D DRAM dies. The benchmark ...