NOVOSENSE Microelectronics has announced the launch of the NSUC1500-Q1, a highly integrated System-on-Chip (SoC) designed to ...

Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky ...

Microchip Technology announces the release of its BR235 and BR235D series of 25A QPL hermetically sealed electromechanical ...

Infineon Technologies AG has introduced the world’s first gallium nitride (GaN) power transistors with integrated Schottky ...

TDK Corporation has expanded its Micronas HVC 5x embedded motor controller family with the HVC 5481G for automotive ...

STMicroelectronics has introduced two new automotive NFC readers in its ST25R portfolio, delivering superior wake-up and ...

TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with X7R characteristics (Class Ⅱ ...

ETSI releases the first Report that outlines a comprehensive analysis of advanced Integrated Sensing and Communication (ISAC) use cases and deployment scenarios, setting the foundation for future 6G ...

OKW has introduced a new machining service for LED backlighting as part of its enclosure customization options. This service ...

RF components such as connectors, cables, antennas, and PCB traces need characterizing so you know how they will perform.

Stackpole Electronics Inc. has introduced the CSSU2512, a new current sense chip resistor designed to handle high power in a ...

Hirose has expanded its popular LF Series of shielded high-speed Ethernet connectors to include a Cat.6a version supporting ...