Sputter deposition normally occurs at a pressure of 10-3 Torr; therefore, the coating is more conformal compared to electron beam deposition.

In particular, high-purity sputtering targets are used in the physical vapor deposition (PVD) process for the manufacture of electronic components, and are key materials for the preparation of surface ...

The team has just determined that its approach – involving plasma nitridation of the SiC surface, sputter deposition of SiO 2 ...

It is also configured with a cryogenic pumping system for a lower base pressure. Sputtering is a deposition process in which a plasma is used to ablate material from a metal or dielectric target. The ...

These systems are built around AJA's unique A300-XP (UHV) or Stiletto Series (HV) magnetron sputtering sources which feature in-situ source head tilting allowing precise and repeatable con-focal, ...

Researchers in China have fabricated a perovskite-silicon tandem solar cell that utilizes an indium oxide sputtering buffer ... arising from the electrode deposition process.