In this paper, we present the results of an evaluation of the 3D Through-Silicon-Via (TSV) technology, using the Timepix4 integrated circuit as a test-vehicle. We will present the concepts for 3D ...

The destroyer Preble successfully test-fired its HELIOS system on a drone target, according to a recently released report.

Until now, there has not been an effective way to assess the risk of rotational brain injury in crash tests. However, thanks ...