Technical challenges including the move to EUV lithography, sub-3nm process technology, 3D die-stacking technologies, and advanced packaging are expected to lift R&D growth rates. January 31, 2020-- ...

explains Dr. Ken Chen, president of GUC. "3D die stacking technology will start a revolution in the way we design HPC, AI and Network Processors. Die-to-die interface is not limited any more to the ...

10 Servers Now Using AMD’s New EPYC With 3-D V-Cache AMD launched the world’s first data center CPU this week using 3-D die stacking ... with 3-D die stacking technology,” said Dan McNamara ...